Hesse & Knipps, Inc., the Americas subsidiary of Hesse & Knipps
Semiconductor [1] Equipment GmbH, leading manufacturer of high speed
fine pitch wedge bonders and fully automatic heavy wire bonders for
the backend semiconductor industry, will demo its next generation
BONDJET BJ93X Heavy Wire Bonder at APEC 2012
(http://www.apec-conf.org/) taking place on February 6-9, 2012 in
Orlando, FL. The BONDJET BJ93x Heavy Wire Bonders feature a heavy wire
bond head with integrated pull test and large table travel (305 mm x
410 mm) that meets automotive electronics and power semiconductor
requirements. "The BONDJET BJ93x Heavy Wire Bonders provide the
large current carrying capacity and high reliability that power
electronics manufacturers demand," states Joseph S. Bubel, president
of Hesse & Knipps, Inc. "They are also the fastest heavy wire
bonders available today."
The BONDJET BJ920 handles aluminum, gold and copper heavy round wire
and ribbon wire at speeds of 3wires/sec. Patented PiQC Process
Integrated Quality Control analyzes 5 critical measurements of bond
quality in real time for every bond, ensuring that only reliable, high
quality devices are produced.
APEC attendees can learn more about BONDJET BJ93x Heavy Wire Bonder
capabilities at Hesse & Knipps' booth – number 914.
More here:
Next-gen Fully Automatic Heavy Wire Bonder Will Demo at APEC 2012
Links:
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[1] http://www.autoparts-marketplace.com/searchkeyword.aspx?q=Semiconductor&ao=0
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